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On-Chip Interconnect Applications

3D Video Graphics Chip Processor

“NVIDIA set the thermal limits of Fermi, its latest GPU, at a vaporizing 105 degrees Celsius.”


The meteoric growth of the graphics chip market has been driven largely by increasing demand for 3D computer graphics, particularly in the high-end gaming and “smart phone” markets. To meet this need, NVIDIA, a market leader in the manufacture and production of graphics processing units, recently introduced Fermi, a graphics processing architecture that features up to 512 cores per chip. However, Fermi’s electrically interconnected cores have been associated with high power consumption and heat dissipation, placing a limit on additional performance improvements.

By harnessing on-chip optical interconnects linked by an ultra-high-bandwidth, high-speed optical bus, PhotonIC Corp.’s proprietary technology would mitigate heat dissipation while allowing for the integration of up to twice as many cores on a chip, resulting in enhanced functionality and performance.

OCDMA for Data Encryption

Code-division multiple-access (CDMA) technologies have long been known for their multiple-access capability as well as for their capacity to provide enhanced security for data communications, as evidenced by their widespread use in wireless networks. Optical CDMA (OCDMA) has the potential to further improve both the transmission speed and the encryption capabilities of such technologies.

PhotonIC Corp.’s OCDMA technology would coexist with conventional wavelength-division multiple-access (WDMA) channels in fiber channels and would use 256-bit encryption in the optical spectral domain, with data rates remaining at 40 Gbps. By contrast, RF/electrical CDMA would require an impractical 10.24-Tbps bit rate. PhotonIC Corp. can accomplish this by virtue of its proven expertise in integrated silicon photonics and its ability to produce highly compact optical components such as ring-resonator-based demultiplexers, combiners, and on-chip detectors.